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Continuously increasing price of gold becomes the major driving force for substituting the gold wire with copper wire in the field of wire bonding. However, since the hardness of copper is higher than that of gold, the potential risk for copper wire bonding is that Cu FAB would cause serious splash on aluminum pad and, even worse, damage of Si die. Since free air ball (FAB) formation is controlled...
The substitution of the copper wire for gold wire has become inevitable in the electronic package, mainly due to the continuously increasing gold price. Moreover, higher electrical conductivity and thermal conductivity make the copper wire capable for high power device. After the electric flame-off (EFO), the grain growth and recrystallization in the heat affected zone (HAZ) induced by the thermal...
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