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This paper is devoted to the demonstration of fundamental differences between the Fourier and non-Fourier heat transfer mechanisms in nanoscale silicon structures. One-dimensional parabolic and hyperbolic heat equation is solved for a simple test structure. Then, the obtained solutions in frequency and time domains are compared.
This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit...
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