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Due to technology scaling and increasing power density thermal issues in today's VLSI integrated circuits are of very high importance. Nowadays, more than a half of IC failures is caused by exceeded heating of a semiconductor structure. Therefore, it is necessary to constantly develop accurate methods capable of predicting temperature profile inside the chip structure. We propose a model to obtain...
Thermal issues in today's VLSI circuits are under intensive research due to technology scaling and increasing power density. Nowadays, more than a half of IC failures is caused by exceeded heating of a semiconductor structure. Therefore, it is necessary to constantly develop accurate methods capable of predicting temperature profile inside the chip structure. We propose a model to obtain variation...
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