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The paper presents the preliminary results obtained on the joints where the new candidate for lead-free solder material was applied. Both SEM microscopy observations combined with the EDX chemical analysis of the Cu/Cu interconnections joined with the SnAuCu alloy at 300°C for different time of flux-less soldering were performed. The scallop-type morphology of n[(Cu, Au)6Sn5] phase growing due to...
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