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Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
A comparison study was done between cold ball pull (CBP) test vs. the conventional ball shear test to further understand the advantages & challenges of CBP test as a method to assess lead-free solder joint performance. From this study, CBP was found to be a better and preferred tool that is able to identify poor lead free solder joint and hence to differentiate the performance of lead free solder...
This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting properties will be obtained by Differential Scanning Calorimetry (DSC). It was found that lwt%Ag 0.5wt%...
This paper study Sn-Ag-Cu solder alloy compositions towards mechanical, surface elemental and thermal properties. Mechanical properties were evaluated by shear strength, while the solder surface oxide depth profile and melting properties were obtained by Auger and differential scanning calorimetry (DSC) respectively. Overall results indicates that Sn3.8AgO.7Cu having the most favorable results with...
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