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We propose a novel probabilistic inference approach that permits predicting, well in advance, the intended destination of a pointing gesture aimed at selecting an icon on an in-vehicle interactive display. It models the partial 3D pointing track as a Markov bridge terminating at a nominal destination. The solution introduced leads to a low-complexity Kalman-filter-type implementation and is applicable...
Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
A study was conducted to assess the backward compatibility of three different lead-free BGA components using Jedec Solderability testing method (JESD22-B102D). The test was conducted at component level. The three components tested were 29??29 mm Thermally Enhanced PBGA (TePBGA-II) and 35??35mm Tape BGA (TBGA) with SAC387 and Sn3.5Ag solder balls, as well as 33??33 mm Flip Chip HiCTE BGA with only...
Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in order to reduce warpage occurrence in all packages, it is proposed that the combination of CTE properties...
Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top...
Wire bonding of 20 micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries...
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