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Taking full advantage of SiC devices, a team from Oak Ridge National Laboratory, the University of Tennessee and Virginia Polytechnic Institute and State University have designed, developed, and tested a phase-leg power module based on a high temperature wirebond package. Details of the layout, gate drive, and cooling system designs are described. Continuous power tests confirmed that our design process...
The full circuit models of two power modules carrying insulated-gate bipolar transistors (IGBT) are obtained using electro-magnetic simulation. Simulation of the full circuit models shows that the planar IGBT module excels the wire-bonded IGBT module in the current sharing capability. The gate inductances and resistances are found to be 60% less in the planar interconnect module than in the wire-bonded...
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