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This paper proposes a semi-flooded cooling concept for a high speed machine design. The electrical machine considered is for an aircraft starter-generator system where power density and efficiency are crucial. In order to achieve the high power density permanent magnet machine, a direct oil cooling strategy for the machine stator is adopted. A stator oil sleeve is designed to separate the machine...
Reliability test of seawater hydraulic pumps in deep-sea environment is a prerequisite for its application in deep-sea equipment such as underwater robot and hydraulic buoyancy adjusting system. It is essential to explore the deep-sea test method and device for seawater hydraulic pumps. Based on the previous studies, a deep-sea simulated experiment devices is developed to test seawater hydraulic pumps,...
NSTX-U uses an inertially cooled OH coil that is cooled with water between shots. Cooling is fed from the bottom of the coil and a cooling wave propagates up the height of the coil. The finite height of the cooling “wave” causes a thermal gradient in the coil that causes a bending stress in the coil build. The larger radial build of the new NSTX Upgrade OH coil produces a shorter “wave” than the previous...
A high temperature, wire-bondless power electronics module with a double-sided cooling capability is proposed and successfully fabricated. In this module, a low-temperature co-fired ceramic (LTCC) substrate was used as the dielectric and chip carrier. Conducting vias were created on the LTCC carrier to realize the interconnection. The absent of a base plate reduced the overall thermal resistance and...
A 6.5kV, wire-bondless power electronics module with a double-sided cooling is proposed and evaluated. A direct solder attachment is employed to minimize parasitic circuit elements and increase current handling capability as well as to enable a double-sided cooling capability with mechanical robustness. Finite element simulations were performed to investigate the thermal performance, critical breakdown...
An InGaAs light emitting diode monolithically integrated with a suspended lens is proposed as a prototype semiconductor electroluminescence refrigeration device. Simulations predict that a temperature drop up to 6degC is achievable in this device.
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