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The thermal stability of sputtered Co–Cu–Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu 50 Ag 50 and monolithic Cu. After annealing at 973K, the grain size of Co 34 Cu 33 Ag 33 was ∼115nm, whereas that of Cu 50 Ag 50 increased to over 700nm. The hardness of annealed Co 34 Cu 33 Ag 33 ...
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