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This paper reports on the interfacial reactions and lifetime of electroless Ni-P coatings in contact with molten Sn-Bi based solders. A layer of approximately 4 mum thick electroless Ni-P in contact with the molten Sn-58Bi solder began to fail at 48 h at temperatures between 200degC and 240degC . Elemental additions to modify the solder, included 1-2wt.% of Al, Cr, Si, Zn, Ag, Au, Ru, Ti, Pt, Nb,...
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