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The frequency dependence of capacitance-voltage (C-V) characteristics of Hg/GaN and Hg/InGaN/GaN Schottky contacts are investigated for 1KHz, 10KHz and 1MHz at room temperature. An anomalous peak in the C-V curves of Hg/GaN sample is observed but no peak for the Hg/InGaN/GaN sample occurs. The interface states, series resistance and minority-carrier injection would be the origin of this anomalous...
This letter presents energy-efficient MgO based magnetic tunnel junction (MTJ) bits for high-speed spin transfer torque magnetoresistive random access memory (STT-MRAM). We present experimental data illustrating the effect of device shape, area, and tunnel-barrier thickness of the MTJ on its switching voltage, thermal stability, and energy per write operation in the nanosecond switching regime. Finite-temperature...
Analog-to-digital conversion plays an essential role in all kinds of electronics systems, including signal processing, communications and storage. In particular, interpolated flash ADC has been widely used in high-speed systems requiring very high sampling speed. Obviously, practical ADC design is very challenging, which has been dominated by experiences and trial-and-error skills. This is true to...
Spreading resistance of a planar Schottky diode is studied as a function of the frequency and buffer layer thickness. The study shows an increase of effective high frequency resistance for a buffer layer thicker than skin depth, due to the parasitic capacitances induced current in buffer layer.
A new combined AC/DC-coupled output averaging technique for input amplifier design of flash analog-to-digital converters (ADC) is presented. The new offset averaging design technique takes full advantages of traditional DC-coupled resistance averaging and AC-coupled capacitance averaging techniques to minimize offset-induced ADC nonlinearities. Circuit analysis allows selection of optimum resistance...
The bimodality of upstream electromigration (EM) failures in the dual damascene structure of 45 nm Cu interconnection process with low-k material is investigated, and the improvement is demonstrated. Two major early failure modes with voids forming in via or at the chamfer of via-trench transition area are revealed and attributed to liner process weakness at the respective locations, which can be...
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