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Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps with 25 ??m in pitch are fabricated at wafer level by electroplating method and the total thicknesses of the platted Cu and Sn are 10 ??m. After plating, the micro bumps on the Si chip are reflowed at 265??C and the variation of bump height measured...
The robustness and dimensions of metal trace is important for electronic packaging applications. For example, materials with good electrical conductivity are essential for reducing IR drops for integrity of electrical signals. Copper metal has good electrical conductivity and hence is the major materials used in electronic packaging. For example in PCB industry, the common methods to form copper trace...
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