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Tin/Indium (Sn/In) nanosolder particles in the size range of 40–70nm were successfully consolidated into nanosolder films by the ultrasonic power consolidation (UPC) method. The consolidated nanosolder film prevents the nanoparticles from oxidation, which is a common problem of nanomaterials during storage and processing, and makes the nanoparticles easier to handle. The quality of the consolidated...
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