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The goal of the presented work is to develop and demonstrate a fabrication process for thin film encapsulation of MEMS devices with large gaps by modifying an existing technique. The process is being developed for encapsulation of silicon micro machined gyroscope which will be fabricated on SOI (silicon-on-insulator) wafers using Bosch DRIE etching technique. The encapsulation of the device is carried...
This paper explores the possibility of using oxidation of sacrificial beams to encapsulate wide gaps. This method of oxidizing silicon beams in order to create diffusion barriers and structural supports has been reported in literatures. The idea is to encapsulate gaps of various widths in a method that is independent of the width of the gaps. In this experiment we try to encapsulate devices and structures...
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