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This paper details an application where E-beam inspection (EBI) can be used for 100% full wafer inspection, generally considered a mythical target for EBI. For process layers where the line-widths and defects of interest are large, very large pixel size and high scan frequency can be used, thereby making full wafer inspection feasible. The metal layers in the back-end-of-line fit this bill when scanned...
This paper details an application where E-Beam Inspection (EBI) can be used for 100% full wafer inspection, generally considered a mythical target for EBI. For process layers where the line-widths and defects of interest (DOI) are large, very large pixel size and high scan frequency can be used, thereby making full wafer inspection feasible. The metal layers in the back-end-of-line (BEOL) fit this...
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