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Durability allocation is an important part of durability design in mechanical system. Whether durability allocation is reasonable or not directly impacts the pertinence and validity of maintenance. When designing durability, lifetime data of components is necessary. The way to obtain lifetime is normally through test which takes so long and cost so much so that it cannot be adopted at initial stage...
Speedy and reliable face location is a key for monitoring driver fatigue driving condition using machine vision methods. According to the disadvantage of face location methods based on single feature in accuracy and reliability at present, first, an improved face location method based on Haar-like feature and Adaboost is used to detect the possibly existing face region in the whole image, then the...
The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Non- leaded) packages. The important SMT factors such as solder pad and stencil designs will be discussed. Secondly and more importantly, this paper will detail the comprehensive experiment and simulation work done for QFN solder joint reliability modeling. A curve fitted fatigue correlation model together...
In this study, two types of global-local models are introduced. One is submodeling, in which a coarse global model is used to simulate the whole model and the fine local model is used to simulate the critical region of interest from whole model. The other is global-local-beam (GLB) model, in which the joint is replaced by an equivalent beam with effective stiffness. For submodeling, two different...
This paper describes a finite element parametric study of the reliability of the solder joints of a flip chip package in which the height H and diameter D of copper column interconnects are varied. It was found that when D was kept constant at 50 mum while H was varied, from 25 mum to 150 mum, there was a local optimum at around H=50 mum. Thus while the compliance of the interconnect with H=100 mum...
This paper examines the board-level solder joint reliability of PBGA, FBGA and CSP packages under temperature cycling (TC) condition, both experimentally and numerically. 11 legs of test vehicles including 2 legs of PBGA, 2 legs of FBGA, 2 legs of two-die CSP and 5 legs of single-die CSP, were assembled with different solder ball sizes, mold compound materials, test board thickness, and solder materials,...
This paper examines the board-level solder joint reliability of UTAC's windows-chip-scale-package (wCSP) under temperature cycling (TC) condition, both experimentally and numerically. Five legs of wCSP test vehicles were assembled with different solder ball sizes, mold compound materials and solder materials, i.e., eutectic Pb-Sn and Sn3Ag0.5Cu. Those assemblies were subject to TC condition using...
This paper focus on the study of solder constitutive model effect on solder joint fatigue life prediction. Two loading conditions are considered, namely thermal cycling and cyclic bending. In this study, four different solder constitutive models including elastic-plastic (EP), elastic-creep (Creep), elastic-plastic-creep (EPC) and viscoplastic Anand's (Anand) models are implemented in FE modeling...
This paper describes a finite element parametric study of the reliability of the solder joints of a flip chip package in which the height H and diameter D of copper column interconnects are varied. It was found that when D was kept constant at 50mum while H was varied, from 25mum to 150mum, there was a local optimum at around H=50mum. Thus while the compliance of the interconnect with H=100mum was...
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