The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Non- leaded) packages. The important SMT factors such as solder pad and stencil designs will be discussed. Secondly and more importantly, this paper will detail the comprehensive experiment and simulation work done for QFN solder joint reliability modeling. A curve fitted fatigue correlation model together...
This paper examines the board-level solder joint reliability of PBGA, FBGA and CSP packages under temperature cycling (TC) condition, both experimentally and numerically. 11 legs of test vehicles including 2 legs of PBGA, 2 legs of FBGA, 2 legs of two-die CSP and 5 legs of single-die CSP, were assembled with different solder ball sizes, mold compound materials, test board thickness, and solder materials,...
This paper examines the board-level solder joint reliability of UTAC's windows-chip-scale-package (wCSP) under temperature cycling (TC) condition, both experimentally and numerically. Five legs of wCSP test vehicles were assembled with different solder ball sizes, mold compound materials and solder materials, i.e., eutectic Pb-Sn and Sn3Ag0.5Cu. Those assemblies were subject to TC condition using...
This paper focus on the study of solder constitutive model effect on solder joint fatigue life prediction. Two loading conditions are considered, namely thermal cycling and cyclic bending. In this study, four different solder constitutive models including elastic-plastic (EP), elastic-creep (Creep), elastic-plastic-creep (EPC) and viscoplastic Anand's (Anand) models are implemented in FE modeling...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.