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Organic memory: Our three‐dimensionally (3D) stacked 8 × 8 cross‐bar array organic resistive memory devices showed non‐volatile memory switching behavior, in which individual memory cells in the different layers can be independently controlled and monitored. The 3D stackable organic memory devices will enable achieving highly integrable organic memory devices and other organic‐based electronics with...
Takhee Lee and co‐workers demonstrate on p. 5048 the fabrication of three‐dimensionally stacked 8 × 8 cross‐bar array organic resistive memory devices. These devices show non‐volatile memory switching behavior, and individual memory cells in the different layers are independently controlled and monitored. The demonstrated 3D stacking fabrication will enable high‐density integration of organic memory...
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