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A new method is proposed to increase the volume fraction of retained austenite and enhance the mechanical performance of low-alloyed steels. By deliberately preserving a small amount of interlath-retained austenite before annealing at a relatively high temperature, new intercritical austenite was thus encouraged to adopt an acicular morphology between laths. Therefore, the formation of blocky austenite,...
An overview is given of developments in unit-process and process-integration technology enabling the realization of through-silicon vias (TSVs) for 3D chip stacking. TSVs are expected to increase interconnect bandwidth, reduce wire delay due to shorter vertical signal path, and improve power efficiency [1–3]. The fabrication sequences for forming TSVs in the middle of the line (via-middle approach)...
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