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• Review/Inspector Cycle Optimization Methodology : □ Integrate the parameters of the inspection machine and review images at the same time. Nuisance rate is reduced significantly, and therefore the sensitivity and productivity of inspectors and review tools are also improved. • Suppress the Bright Field Inspection Nuisance Rate: □ Base on the reviewed patch images information and feasible threshold...
• Inspecting the wafer edge issue: Wafer bevel inspection can help us to find out the root cause of yield loss from wafer edge or partial die. • Monitoring EBR/ 193 lithography performance : From the EBR monitoring results, bevel inspection find out the top EBR recipe setting is not good, and it also demonstrates the EBR performance with different bevel rinse RPM setting, it can help us to find out...
• Key Technology for Invisible Defects Detection: Electron beam inspection (EBI) system using the Leap & Scan mode with external electric field is a key technology for root cause analysis of invisible defects. • Issues in Continuous Inspection Mode : Continuous inspection mode suffers serious misalignment and low voltage contrast issues, it is hard to inspect the irregularly periphery area. •...
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