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We show that room temperature bonding of a 332 × 268 bump array can be realized by using ultrasonic bonding of cone-shaped bump. 25 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A conventional planar electrode made of electroplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in...
Lots of submesh allocation strategies are devised in mesh connected computers. In chip multiprocessors connected by network on chip, submesh allocation is also used to allocate processors. Existing research mainly focuses on fragmentation, system performance and algorithmic complexity. The processors are assumed to be homogeneous, and the representation of them only reflects the state of processors...
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