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Cu wire bonding research has exploded exponentially in the past few years. Many studies have been carried out to understand the different behaviours of Cu wire and Au wire. One of the observations on Cu wire bonding is the excessive formation of aluminium (Al) splash on the bond pad due to a higher bond force. This leads to pad peeling and bond failure resulting in poor reliability performance of...
Copper (Cu) wire bonding is getting more common as interconnections on aluminium (Al) bond pad metallization in microelectronics due to lower cost compared to gold wire bonding. The Cu-Al intermetallic compounds (IMC) growth in Cu ball bonds has been investigated by many researches but the understanding of the IMC phases is still incomplete and the impact to bond reliability know-how is limited. This...
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