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Anisotropic conductive adhesives (ACAs) have been considered a promising interconnect material for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA interconnects have been the limitations to utilizing ACAs in high power devices. In this study, we have introduced conjugated dithiols into ACA formulations to create molecular wire junctions...
Anisotropic conductive adhesives (ACAs) have been considered as one of promising interconnect materials for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA joints have been a bottleneck to deploy ACAs in high power devices. In this study, we introduced conjugated dithiols into ACA formulations to construct the molecular wire junction...
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