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In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible...
Determining how to accurately estimate and control the loss of a channel is critical to the success of the design of a high-speed I/O link. As Printed circuit boards (PCB) continue to be a key ingredient of a computer system design, the cost-effective characterization of the PCB materials and the measurement of the loss PCB traces in a given stackup have become a necessary step in the computer design...
In this paper, a technique is proposed to improve the electrical performance of high speed signaling through direct printing additional dielectric or other types of materials onto the PCB interconnect using inkjet printing. Inkjet printing is used to coat thin film or other structures onto the microstrip, via pad, pin field, or other structures on PCB. The electrical performance of interconnects can...
A novel method called SNEM (full S-parameter synthesis from near-end measurement) is proposed to obtain the full S-parameter matrix by probing only a subset of all the ports of a passive linear network. Other ports that are not probed need to be terminated by various impedance values. A termination error correction algorithm and a guideline for choosing termination impedance values have also been...
This paper presents a practical method to mitigate crosstalk in flex circuit due to high density routing. The method will maintain the routing density while the signal integrity performance will be improved. Practical flex construction method is also proposed for high speed flex interconnects between two chips. The effectiveness of the method is proved by 2D/3D modeling of the flex transmission lines.
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