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Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical interconnection, excellent path for thermal transfer...
Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical interconnection, excellent path for thermal transfer...
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