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A 3-D ring oscillator integrated with through silicon vias (TSVs) is designed and fabricated for testing multilayer stacked integrated circuits with TSV. The proposed 3-D ring oscillator consists of 13 stages. 65-nm CMOS dies with two current-starved inverter and via-last TSVs are designed for the five middle layers of 3-D ring oscillator. The two cascaded inverters are connected to the up-side layer...
At present, a complete measurement system has been built up successfully by our laboratory, besides its engineering implement has been accomplished also. We can show an antenna's radiation field in a form of 3D animation dynamically with this measurement system, which demonstrates the time-domain near-field measurement theory and the time-domain near-field measurement system are practical. The present...
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