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Solar energy is typically converted into electrical energy or collected as thermal energy. Co-generation of electricity and low-grade heat allows a more efficient use of the solar spectrum. To this end, a prototype of a high-concentration photovoltaic thermal (HCPVT) system is demonstrated. It is based on low-cost optical concentrator materials, a high-efficient, densely-packed multi-cell receiver...
The soaring demand for computing power in our digital information age has produced, as an undesirable side-effect, a surge in power consumption and heat density for Multiprocessors Systems-on-Chip (MPSoCs). The resulting temperature rise results in operating conditions that already preclude operating all the cores at maximum performance levels, in order to prevent system overheating and failures....
A novel semi-fluxless die-to-die bonding solution is presented, developed and successfully tested. Consisting of patterned thin film lead-free solder, this method was developed to meet the constraints given by the integration of state-of-the-art cooling structures into a 3D chip stack, such as minimizing the gap between the dies, sealing the active solder pads from a conductive coolant fluid and sealing...
The following study focuses on the scalability of single- and two-phase cooling techniques to address the cooling constraints and requirements of future vertically integrated chips. Water and refrigerant R134a were considered for single- and two-phase cooling respectively during simulations. A parametric study based on fin height, fin width and channel width of multi-microchannel heat removal structures...
Molecular dynamics simulations (MD) and the normal mode decomposition are used to determine the phonon relaxation times of acoustical and optical modes of germanium (Ge) at 1000 K and 1 atm. The relaxation times are calculated from the temporal decay of the autocorrelation function of the total energy of each normal mode in the [100] direction. Two sets of force field parameters are used to obtain...
Liquid cooling has emerged as a promising solution for addressing the elevated temperatures in 3D stacked architectures. In this work, we first propose a framework for detailed thermal modeling of the microchannels embedded between the tiers of the 3D system. In multicore systems, workload varies at runtime, and the system is generally not fully utilized. Thus, it is not energy-efficient to adjust...
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