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In this paper, we report a comparison of interfacial reactions of Sn-3.8Ag-0.7Cu (SAC 387) and SAC (0–1.5 Zn) solder pastes on Cu (organic solderability preservative finish) and Au/Ni-P/Cu [electroless Ni immersion gold (ENIG)] substrate metallizations with Ni/Sn and Cu/Sn plated component leads. Zn added to the paste in the form of surface-coated micrometer-sized particles dissolves into the solder...
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