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Thermal interface materials (TIMs), including thermal conductive adhesives (TCAs), grease, phase change materials (PCMs) and thermal pads, are widely used in thermal management for electronics system. In this work, a bimodal thermal conductive adhesive (b-TCA) composed of epoxy matrix and silver fillers were developed. The silver fillers consist of silver flakes and silver particles. The specimens...
Thermal interface materials have been widely adopted in the thermal management for electronics system. Most of the thermal interface materials are made of polymers with thermally conductive particles distributed inside to enhance the thermal conductivity. Thus it is essential to figure out the effective thermal conductivity of this composite material. In the present paper, a parameterized cubic cell...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
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