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Numerical simulation of micro-bumped flip chips mounted on a TSV interposer is conducted to study the thermal performance of the package. The 3D package, which consists of two chips, each dissipating 4W, is evaluated under various conditions with its thermal resistances θja θjb, θjc and θjma determined according to JEDEC or MIL-STD standard. Instead of building the detailed model, equivalent thermal...
A simplified numerical methodology is proposed to simulate bubble nucleation for flow boiling heat transfer in the microchannels heat sink. Flow boiling characteristics such as bubble departure frequency, bubble grow time, waiting time, and nucleation site density, as well as bubble departure diameter are modeled using empirical theoretical correlations for the bubble nucleation simulation in the...
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