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3D integration provides opportunities to design high-bandwidth and low-power CMOS image sensors (CIS) [1–4]. The 3D stacking of pixel tier, peripheral tier, memory tier(s), and compute tier(s) enables high degree of parallel processing. Also, each tier can be designed in different technology nodes (heterogeneous integration) to further improve power-efficiency. This paper presents a case study of...
We have proposed a wideband Fabry-Perot cavity (FPC) antenna with a partially reflective superstrate composed of successively tapered meander loops. To obtain a wide beam width in an azimuthal direction, we have intentionally designed a radiating aperture in a rectangular shape with an aspect ratio of 6:1. Moreover, to further increase antenna gain with a limited aperture area, we have closed all...
Using continuous-wave lasers and picosecond optical pulses, we demonstrate initialization, single qubit gates, and two qubit gates in a system of two electron spins in separate tunnel-coupled InAs quantum dots.
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