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In this paper, a 200 nm n-channel inversion-type self-aligned In0.53Ga0.47As MOSFET with a Al2O3 gate oxide deposited by Atomic Layer Deposition (ALD) is demonstrated. Two ion implantation processes using silicon nitride side-wall are performed for the fabrication of the n-type source and drain regions. The 200 nm gate-length MOSFET with a gate oxide thickness of 8 nm features the transconductance...
We have observed the transport properties in magnetic tunnel junction with the multilayered structure: (50 nm)/Al-O (1 nm)/CoFeB (5 nm)/Ta (10 nm)/Ru (10 nm). The maximum normal tunneling magnetoresistance (TMR) ratio was found to be 12.4% at a temperature range around 100 K, and the maximum inverse TMR ratio was observed to be 3% at a temperature of 5 K . The inverse TMR decreases with increasing...
In this report, we will demonstrate that by simply using a bilayer capping layer of Ru/Ta instead of usually used Ta, the switching field, as well as distribution of switching fields, of magnetic tunnel junctions (MTJ) can be considerably reduced. Two samples with the same MTJ stack of Ta/PtMn/SAF-pinned/AlOx/CoFeB(2 nm) (bottom to top) but capped by different metal layers of Ta and Ru/Ta, correspondingly,...
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