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We propose the three dimensional direct access multi-port buffer (3D DA-MPB) architecture for the design of 3D MP-SoCs using the wafer stack method as a fabrication technology. We design a 3D interconnection architecture template. The design method can integrate numerous processors onto a single chip. We illustrate the data transfer process between multi-port buffer storage blocks through simulations...
This paper presents a method of design for three dimensional multi-processor system on chip (3D MP-SoC); specifically, we recommend a three dimension direct access multi-port memory (3D DA-MPM) architecture using wafer stack technology. First, we illustrate the data transfer process between multi-port memories with simulation waveforms. Next, we resolve the data transfer path routing problem using...
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