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This paper gives a comprehensive overview of literature data on the reliability of different alternative Pb-free assembly technologies for high temperature applications with 4 groups of materials: SAC based solder alloys, Silver filled epoxies, Eutectic AuSn solder and a thermal interface material. For each group, the typical degradation models and mechanism of different material compositions in the...
More and more, reliability is seen as a key differentiator in an extremely competitive globalized market. Recent examples from the automotive sector illustrate very well how serious the impact from field problems can be, more in particular when safety risks are possibly involved: liability claims, recall actions, negative effect on the market share of a brand and so on. But how to match the growing...
Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder...
The paper presents a collection of slides about network transformation that requires the evolution of multiple network layers in the same timeframe. Network usage is application driven, and there is a great deal of uncertainty in applications demand and user behavior. Operators face critical choices in network architecture and technology that can have great impact on their business goals. A unified...
Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict...
In this paper, we present a new type of 2-2 piezoelectric ceramic-polymer composite operated at the transverse piezoelectric mode (TP). The new TP mode piezocomposite has exceptionally high hydrostatic piezoelectric response, high reliability, and can be made at low cost. Based on the isostrain approximation, an analytical model is developed to analyze and optimize the effective piezoelectric and...
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