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This paper studies the potential of using wafer probe tests to predict the outcome of future tests. The study is carried out using test data based on an SoC design for the automotive market. Given a set of known failing parts, there are two possible approaches to learn. First a single binary classification model can be learned to model all failing parts. We show that this approach can be effective...
This work proposes a wafer probe parametric test set optimization method for predicting dies which are likely to fail in the field based on known in-field or final test fails. Large volumes of wafer probe data across 5 lots and hundreds of parametric measurements are optimized to find test sets that help predict actually observed test escapes and final test failures. Simple rules are generated to...
This paper presents a novel behavioral-level analog circuit performance modeling methodology using kernel based support vector machine (SVM). Behavioral modeling for analog circuits is in high demand for architectural exploration and system prototyping of increasingly complex electronic systems. In this paper, we investigate the effectiveness of applying SVM to model analog circuits. Based on the...
As lithography process nodes shrink to sub-wavelength levels generating acceptable layout patterns becomes a challenging problem. Traditionally, complex convolution based lithography simulations are used to estimate areas of high variability. These methods are slow and infeasible for large scale full chip analysis. This work proposes a solution to this problem by using machine learning techniques...
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