The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper gives a comprehensive overview of literature data on the reliability of different alternative Pb-free assembly technologies for high temperature applications with 4 groups of materials: SAC based solder alloys, Silver filled epoxies, Eutectic AuSn solder and a thermal interface material. For each group, the typical degradation models and mechanism of different material compositions in the...
Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder...
The problem of solder joint fatigue is essentially one of fatigue crack growth. However, little work has been done that enables fatigue life predictions by means of tracking the crack front and its growth. Most popular fatigue life models are empirical and therefore, limited in their applicability and in the insight they provide. Analytical fracture mechanics approaches such as the Paris Law and the...
The problem of solder joint fatigue is essentially one of fatigue crack growth. However, little work has been done that enables fatigue life predictions by means of tracking the crack front and its growth. Most popular fatigue life models are empirical and therefore, limited in their applicability and in the insight they provide. Analytical fracture mechanics approaches such as the Paris law and the...
Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.