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This paper gives a comprehensive overview of literature data on the reliability of different alternative Pb-free assembly technologies for high temperature applications with 4 groups of materials: SAC based solder alloys, Silver filled epoxies, Eutectic AuSn solder and a thermal interface material. For each group, the typical degradation models and mechanism of different material compositions in the...
Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder...
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