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For high demand of large bump density, fine pitch micro Cu bumps are usually connected to trace on the substrate with flip chip technology. In this study, TCNCP (Thermal Compression with Non-Conductive Paste) method was used to attach die onto substrate trace with surface finish (SF) of thin Ni (0.1um) and thick Au (0.4um) in a flip chip (FC) package. The micro Cu bump used in the device under test...
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