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Numerous experimental studies on electrically conductive polymer have showed that the flip chip bonding and BGA socket with conductive polymers have a certain amount of contact resistance between contact pad and conductive polymer and among fillers, in addition to bulk resistance of fillers themselves. The ingress of insulating films into the contact area results in an increase of contact resistance...
The CSBGA package is targeted for the next generation of wireless systems, since this packaging technology occupies significantly less real estate than conventional packaging. The smaller packages not only accommodate the shrinking size of cellular phones but also contain lower parasitics, which reduces signal integrity losses. This innovative new software is targeted for the engineer who, at his...
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