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Nucleation and growth mechanism of sequential electroplating of gold over thick tin layer have been studied by SEM, EDX and X-ray diffraction method. It is found that the growth mechanism of Au layer on top of Sn layer is diffusion-controlled process and the primal Au–Sn intermetallic compound and Au phases are AuSn 4 (211) and Au(111), respectively. The plated gold atoms nucleate and form...
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