The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Advantages of Anisotropic Conductive Films (ACF) technology, especially the low bonding temperature, fine pitch capability, elimination of lead and low cost, have resulted in ACF interconnects being widely used in contemporary portable electronic devices. Such products are exposed to various types of mechanical loadings, such as shock and impact during handling and accidental drops, throughout their...
This study focuses on quasi-static mechanical cycling durability of copper traces on printed wiring assemblies (PWAs). PWA specimens populated with Land Grid Array (LGA) components on copper-defined pads were cycled to failure under zero-to-max, three-point bending. Failure is defined in terms of electrical opens due to fatigue damage propagation through the entire cross section of the trace. Failure...
The continuing increase of functionality and miniaturization in handheld electronics has resulted in a decrease in the size and weight of the product. Therefore, internal structures such as printed wiring boards (PWBs) are becoming more slender, thus increasing the likelihood of unintentionally causing contact between the PWB and other internal structures like battery compartments, displays, and other...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.