The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The focus of this paper is on a modeling methodology for capturing the complex mechanical behavior of a single layer pressure-sensitive adhesive (PSA) system, based on empirical observations of its stress-strain behavior. This study is motivated by the fact that there is very limited modeling ability to mechanistically predict the bimodal stress-strain curves of single-layer PSAs. Empirical observations...
Nanoindentation has been popular since the 1970s for querying material behavior at extremely small length scales. This paper focuses on using a combination of indentation and FEA methods for characterizing the viscoplastic behavior of composite materials and sintered materials, which pose additional challenges because of the heterogeneous morphology. In particular, this paper focuses on two forms...
Advantages of Anisotropic Conductive Films (ACF) technology, especially the low bonding temperature, fine pitch capability, elimination of lead and low cost, have resulted in ACF interconnects being widely used in contemporary portable electronic devices. Such products are exposed to various types of mechanical loadings, such as shock and impact during handling and accidental drops, throughout their...
This study focuses on assessing the effects of temperature on vibration durability of SAC305 PWAs under random vibration excitation on a repetitive shock (RS) shaker. Major complexities involved in quantifying random vibration response and durability data are first discussed through a comparison of specimen unimodal response under harmonic excitation versus multimodal response to random excitation...
In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects...
This study examines the effect of cyclic damage on the constitutive response of Sn3.0Ag0.5Cu (SAC305) solder material. Cyclic damage is induced through isothermal, mechanical cycling tests at high strain rate and room temperature, using a modified lap-shear microscale specimen (180 mum wide solder joint). The elastic, plastic, and yield response of the cycled solder joints are measured as a function...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.