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To optimize intensity-localization in spatio-temporally focused ultrafast beams we demonstrate spectral interferometric and spectrally-resolved knife edge scan methods to characterize lateral and angular spatial chirp. A novel dispersion scan yields the focused-pulse spectral phase.
In this work the life time of solder joints of SMD components is studied under vibration loading. This kind of purely mechanical load is one of the main failure causes in automotive electronics. A test vehicle has been designed to enable vibration testing on SMD capacitors (size 0805). The test vehicle is distinguished with a line clamping and stripe shape which both leads to a concerted loading of...
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