The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The focus of this paper is on a modeling methodology for capturing the complex mechanical behavior of a single layer pressure-sensitive adhesive (PSA) system, based on empirical observations of its stress-strain behavior. This study is motivated by the fact that there is very limited modeling ability to mechanistically predict the bimodal stress-strain curves of single-layer PSAs. Empirical observations...
Nanoindentation has been popular since the 1970s for querying material behavior at extremely small length scales. This paper focuses on using a combination of indentation and FEA methods for characterizing the viscoplastic behavior of composite materials and sintered materials, which pose additional challenges because of the heterogeneous morphology. In particular, this paper focuses on two forms...
Bias Temperature Instability (BTI) degradation and recovery with different types of MOL capping layers are investigated in a 20nm Replacement Metal Gate (RMG) CMOS technology. It is found that less compressive RMG capping layers substantially improve reliability and device performance because of less hydrogen within the RMG capping material. The hydrogen content plays an important role in BTI degradation...
This study focuses on assessing the effects of temperature on vibration durability of SAC305 PWAs under random vibration excitation on a repetitive shock (RS) shaker. Major complexities involved in quantifying random vibration response and durability data are first discussed through a comparison of specimen unimodal response under harmonic excitation versus multimodal response to random excitation...
This study examines the effect of cyclic damage on the constitutive response of Sn3.0Ag0.5Cu (SAC305) solder material. Cyclic damage is induced through isothermal, mechanical cycling tests at high strain rate and room temperature, using a modified lap-shear microscale specimen (180 mum wide solder joint). The elastic, plastic, and yield response of the cycled solder joints are measured as a function...
This paper presents a study of the probabilistic effects that act in addition to deterministic (mechanistic) effects to reduce the thermal cycling durability of ball grid array (BGA) interconnects as the component I/O count increases. The mechanistic drivers include increasing thermal expansion mismatch with increasing package size and increasing stress levels with decreasing solder joint size. The...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.