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Nanoindentation has been popular since the 1970s for querying material behavior at extremely small length scales. This paper focuses on using a combination of indentation and FEA methods for characterizing the viscoplastic behavior of composite materials and sintered materials, which pose additional challenges because of the heterogeneous morphology. In particular, this paper focuses on two forms...
Advantages of Anisotropic Conductive Films (ACF) technology, especially the low bonding temperature, fine pitch capability, elimination of lead and low cost, have resulted in ACF interconnects being widely used in contemporary portable electronic devices. Such products are exposed to various types of mechanical loadings, such as shock and impact during handling and accidental drops, throughout their...
Failure analysis of field failed stepper motors of optical disk drive (ODD) reveal that the failure mechanism and failure site of the stepper motor is wear of the plastic bearing cup that supports the stepper motor worm shaft. In an ODD this worm shaft moves the sled carrying the optical head, thus generating both axial and lateral loads as well as circumferential sliding friction forces on the bearing...
Durability and reliability assessment is a key aspect of new product development. The focus of this paper is to assess the durability of the electrical joint of a PV product by examining its fatigue life under cyclic temperature excursions experienced throughout the product life cycle. An in progress method is presented for product life prediction as function of its deployment location. The life prediction...
In the conversion to Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with the added benefit of low temperature, processing (Lau et al., 2002). This paper explores the degradation mechanisms and kinetics in adhesively bonded Au-bumped flip chip interconnects. Earlier researchers have suggested that electrical contact is...
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