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In this paper, we are interested in the Halogen-free (HF) impact on the reliability performance of portable electronic devices. Due to the trend of environment protection, the Halogen-free materials of solder paste, molding compounds, PCB and etc. have been widely discussed. When the material changes happen, the transition of failure modes in the board level can be expected, and the challenges are...
A strain-controllable dynamic bending method on WLCSP has been proposed in this paper. In order to identify the principle factor among the effects of stiffness attributed by different board level structures, the 0.4 mm pitch WLCSP packages with Sn-4.0Ag-0.5Cu solder ball are used. This combination of WLCSP is considered to have the high stiffness in the structure. It is also shown that there are interactions...
With the more reliability requirement increasing in the IC packaging for mobile product, the testing condition to simulate the service life of IC packaging on board will be emphasized, such as mechanical drop, temperature cycling, bending, vibration and so on. 4 point cyclic bending condition including different bending frequency and displacement to simulate actual service condition is defined in...
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