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The integration of III-V compound semiconductors and silicon (100) CMOS technologies has been a long pursued goal. A robust low-cost heterogeneous integration technology would make the outstanding analog and mixed-signal performance of compound semiconductor electronics available on an as-needed basis to realize key functions on VLSI chips that are difficult to implement in Si technology. In this...
For the first time strain additivity on III-V using prototypical (100) GaAs n- and p-MOSFETs is studied via wafer bending experiments and piezoresistance coefficients are extracted and compared with those for Si and Ge MOSFETs. Further understanding of these results is obtained by using multi-valley conduction band model for n-MOS and performing k.p simulations for p-MOS. For GaAs n-MOSFET, uniaxial...
We performed a degradation study of high-brightness Nichia single-quantum well AlGaN-InGaN-GaN green light-emitting diodes (LEDs). The devices were subjected to high current electrical stress with current pulse amplitudes between 1 A and 7 A and voltages between 10 V and 70 V with a pulse length of 100 ns and a 1 kHz repetition rate. The study showed that when the current amplitude was increased above...
Visible light-emitting diodes (LEDs) emitting at 615 nm and employing the AlGaInP/GaInP double heterostructure (DH) grown on a lattice-matched GaAs/sub 0.7/P/sub 0.3/ substrate have been fabricated for the first. The external quantum efficiency of 0.156% for the orange LEDs can be achieved by introducing the GaP material as the current spreader and window layer for the DH LEDs.<<ETX>>
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