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Thermal impact on back-end interconnects resulted from self-heating (SH) effect in FinFET devices is investigated here. The self-heating effect in FinFET devices will generate more heat in fin structures than planar devices and influence the reliability of interconnects. In this study, testing structures including metal sensors of different metal layers are designed, fabricated and measured, as well...
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temperature distribution in solder bump of micro bump is nearly uniform. In addition, the hot side is near the substrate side, whereas the cold side is near...
Phase change memory (PCM) uses rapid heating and cooling to induce switching in sub-micron memory cells. The rapid rates of heating and nanoscale dimensions require accurate modeling of thermal transport phenomena in the constituent materials. This motivates improved understanding of the thermal properties of Ge2Sb2Te5 (GST) thin films and PCM electrode materials. We report measurements of thermal...
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