The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
On one hand, with the rapid increase of integrated circuits (ICs) I/O number, the traditional package technique does not meet the need of pioneer development. On the other hand, three-dimensional integrated circuits (3-D ICs) become more and more popular to satisfy the multi-function chip development. One of the best solutions of these needs is the ultra-fine pitch micro-bumps. The micro-bumps can...
In this decade, the Moore's law does not fit the trend of technological improvement any more. In order to keep the increasing rate of device density and I/O numbers, the size of devices shrink rapidly. In this kind of condition, the stack of integrated circuit (IC), which is also called three-dimensional integrated circuits (3-D ICs), is a preferable solution of the next-generation products. There...
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temperature distribution in solder bump of micro bump is nearly uniform. In addition, the hot side is near the substrate side, whereas the cold side is near...
Electromigration of flip-chip solder joints has been studied extensively in recent years. It was investigated in plenty of studies that the current crowding effect takes place at the corner near the traces due to huge differences in cross-section area between traces and solder joint. The local high current density, which has been known as a serious reliability issue, causes the failure such as void...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.