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Failures under dynamic mechanical stresses caused by impact and drop loading are an important concern when assessing the durability of portable, hand-held electronic products. This study focuses on failures in COTS MEMS packages on PWAs, due to repeated drop and impact events. This MEMS component uses a system-in-package (SIP) configuration, consisting of a MEMS microphone chip and an ASIC signal...
The continuing increase of functionality and miniaturization in handheld electronics has resulted in a decrease in the size and weight of the product. Therefore, internal structures such as printed wiring boards (PWBs) are becoming more slender, thus increasing the likelihood of unintentionally causing contact between the PWB and other internal structures like battery compartments, displays, and other...
In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects...
Advances in drop tower technology have extended the range of obtainable accelerations in drop testing from 5,000 Gs to as much as 100,000 Gs. To achieve excitations in excess of the conventional 5,000 Gs, a mechanical accelerator, called the Dual Mass Shock Amplifier (DMSA), is mounted on the drop table. This device produces extremely high, short duration shock amplitudes, by using secondary impacts...
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